Didier Boivin is President and CEO of 3DSP, and is a telecommunication semiconductor industry veteran. As the chief executive, Boivin will lead the company into expanding its SoC business for DSP-oriented applications in the focused markets of Multimedia, Voice over Packet and Wireless LAN.

Prior to joining 3DSP, Boivin was the President of North American operations for DSP Group and CEO of its VoicePump IC subsidiary. At VoicePump, Boivin lead the company in developing, manufacturing and selling integrated silicon and software solutions to the broadband market. He has also held executive management positions at Alcatel Microelectronics, Rockwell Semiconductor Systems and TRT, a subsidiary of Philips.

Boivin holds an electrical engineering degree from Ecole Centrale d’Electronique in France, and an Executive MBA from the University of Texas in Dallas.