04/11/01

3DSP CLOSES NEW VENTURE ROUND WITH INVESTMENT FROM INTEL CAPITAL

IRVINE, Calif., April 11, 2001 - 3DSP Corporation, a leader in configurable digital signal processor (DSP) architecture and associated system-on-a-chip (SoC) designs, today announced that it has received an investment from Intel Capital as part of its recently completed round of venture capital financing. Completion of this third financing round brings total venture capital investment in 3DSP to $24 million. Terms of the Intel Capital investment are not available.

"This round of investment allows us to aggressively pursue the development of our next generation DSP architecture," said Tom Beaver, president and CEO of 3DSP. "We will expand all areas of our development team with emphasis on processor architects, software and applications engineers, while also building our sales, marketing and operations force as we grow our network of strategic partners and lead customers."

About 3DSP

3DSP is a leader in implementing advanced digital signal processing solutions in silicon for embedded systems. The company offers the industry's only fully configurable DSP architecture, backed by a comprehensive object-oriented design environment and application-based intellectual property to speed complex system-on-a-chip (SoC) implementations to silicon with first time success. 3DSP's capabilities are used by Internet, broadband, wireless and multimedia designers to implement their next generation products. For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16721 Laguna Canyon Rd., Irvine, CA 92618 (phone: (949)435-0600; fax: (949)435-0700.

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