01/29/01

SEMICONDUCTOR INDUSTRY VETERAN THOMAS A. BEAVER JOINS 3DSP - THE LEADER IN CONFIGURABLE DSP TECHNOLOGY - AS CEO AND PRESIDENT

Irvine, CA, January 29, 2001 - Thomas A. (Tom) Beaver, most recently president and CEO of Wyle Electronics, has joined 3DSP Corporation, the leader in configurable digital signal processor (DSP) architecture and associated system-on-a-chip (SOC) design and verification development tools, as CEO and president.

Beaver will be taking over the executive management reins of the company from founder Kan Lu, who remains with 3DSP as chief technical officer.

Beaver indicated that "I believe that 3DSP's configurable DSP architecture and advanced object-oriented SOC design system uniquely position our company to shorten the design and engineering cycle for ever more complex semiconductors in a number of high-growth marketplaces. I look forward to the challenges of managing a rapidly expanding sales, marketing and engineering organization that will provide the service and support 3DSP's fast growing customer base will need to create tomorrow's most advanced wireless, graphics and multimedia, audio and voice-over-packet products."

Beaver joins 3DSP from Wyle Electronics, a major part of the VEBA Electronics group, where he was president and CEO. Under his leadership, Wyle became the acknowledged leader in demand creation for advanced semiconductors in the electronics distribution marketplace. Prior to that, he served Astec Power, Inc., a division of Emerson Electric and the world's leading supplier of power conversion products, as executive vice president for worldwide sales and marketing. Before that he held a succession of increasingly responsible sales, marketing and senior management positions at Motorola over a 30-year span. In his most recent position at Motorola, he was corporate vice president and director of the company's Networking and Computer Systems Group's marketing and sales team.

Beaver earned BSEE and BSBA degrees at Marquette University and an MBA from the University of Minnesota. He resides in Dana Point, CA.

About 3DSP

3DSP is a leader in implementing advanced digital signal processing solutions in silicon for embedded systems. The company offers the industry's only configurable DSP architecture, backed by a comprehensive object-oriented design environment to speed complex system-on-a-chip (SOC) implementations to silicon with first time success. 3DSP's capabilities are used by Internet, broadband, wireless and multimedia designers to implement their next generation products. For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16735 Von Karman, Suite 100, Irvine, CA 92614 (phone: (949) 260-0156; fax: (949) 260-0151).