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10/19/01
3DSP UNVEILS THE INDUSTRY'S FIRST UNIVERSAL PHY PROCESSOR - UNIPHY
IRVINE, CA, October 19, 2001 - 3DSP Corporation™, the leader in configurable digital signal processor (DSP) architectures, today unveiled UniPHY™, the first IP core highly optimized for universal physical layer signal processing (PLSP) in broadband communications. The UniPHY core's custom instructions and architectural features are specifically tuned towards PLSP applications-including Wireless LAN (802.11a, 802.11b, HiLAN2), and xDSL. With the flexibility to program a multiple-standard PHY solution on the same processor, UniPHY's low power design and application specific optimizations ensure efficient power consumption.
Capable of execution speeds between 400 MHz and 1 GHz, the UniPHY processor combines an accelerated version of 3DSP's super-scalar SIMD (SuperSIMD®) architecture and SP-X™ instruction set with a new expansion instruction mode. Expansion instructions unleash the processor's full computational power by allowing simultaneous use of all 12 of its functional units. This combination allows UniPHY to provide efficient code size along with the raw processing power required to perform critical broadband communications algorithms.
"We developed UniPHY specifically to meet the ever-evolving PHY layer standards for multiple broadband communication protocols," said HD Boesch, vice president of marketing at 3DSP. "In essence, UniPHY resolves the challenge of interoperability and multiple standards that system integrators constantly face."
UniPHY's 64-bit wide expansion instructions execute up to 12 parallel arithmetic operations per cycle with additional built-in load and store capabilities. SoftDatapath™ technology combines the data throughput performance of application specific datapaths with programmability. Additionally, datapath registers eliminate register file and memory access bottlenecks by feeding intermediate results of calculations directly to another functional unit.
"The UniPHY concept is a compelling DSP solution for a variety of products in the growing broadband communication market," said Will Strauss, president of market research firm Forward Concepts. "It's the first core I've seen that can provide performance levels that approach ASIC solutions, while retaining the flexibility for implementing multi-standard solutions that allow licensees to significantly differentiate their products."
3DSP's UniPHY IP core is available for licensing fourth quarter, 2001 along with compiler, assembler, debugger and simulator tools. To accompany the UniPHY core, 3DSP is developing a reference chip and application software that initially includes 802.11a, 802.11b, HiLAN2 and SPEEDi™.
"The UniPHY concept is a compelling DSP solution for a variety of products in the growing broadband communication market," said Will Strauss, president of market research firm Forward Concepts. "It's the first core I've seen that can provide performance levels that approach ASIC solutions, while retaining the flexibility for implementing multi-standard solutions that allow licensees to significantly differentiate their products."
3DSP's UniPHY IP core is available for licensing fourth quarter, 2001 along with compiler, assembler, debugger and simulator tools. To accompany the UniPHY core, 3DSP is developing a reference chip and application software that initially includes 802.11a, 802.11b, HiLAN2 and SPEEDi™.
| UniPHY™ Performance Benchmarks |
| Benchmark |
Number of Cycles |
| FIR (T=32, N=100) |
442 |
| 256-pt Complex FFT |
659 |
| Viterbi GSM |
608 |
802.11a Baseband RX
with Viterbi |
492 MCPS |
802.11a Baseband RX
without Viterbi |
114 MCPS |
About 3DSP Corporation
3DSP offers the industry's only fully configurable digital signal processing architecture with a comprehensive object-oriented design environment and application-based intellectual property. 3DSP's technology empowers system designers to create custom SoC solutions in silicon that achieve significant competitive advantages in terms of performance, integration, power consumption, cost and time-to-market for tomorrow's multimedia, wireless and Voice over Packet applications. Industry leaders including Agilent, ATI, National Semiconductor and Syntek license 3DSP technology. 3DSP's principle investors include Alcatel Ventures, Intel Capital and FVIC. For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Rd., Irvine, CA 92618, phone: (949) 435-0600 fax: (949) 435-0700.
3DSP Corporation, 3DSP, SoftDatapath, SuperSIMD, UniPHY, SPEEDi, SP-X, SP-3, and SP-5 are trademarks of 3DSP Corporation.
Contacts:
Chris Kresch
Young Company
+1 310 899 3375
ckresch@youngcompany.com
Annette Keller
3DSP
+1 949 435 0580
akeller@3dsp.com
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