10/03/01

3DSP ENTERS MULTIMEDIA STREAMING ARENA WITH MPEG-4 PROJECT

IRVINE, Calif., October 3, 2001 - 3DSP Corporation, the leader in configurable digital signal processor (DSP) architectures, today announced its comprehensive project focusing on the development of different profiles for MPEG-4 audio and video applications. MPEG-4, a flexible multimedia communications technology, is positioned to become the standard for streaming Audio/Video (AV) media on the Internet and wireless networks as it bridges the gap between the web and conventional AV media.

MPEG-4 consists of different subsets, referred to as profiles, which enable applications ranging from 3G cell phones through studio-quality equipment to utilize specific performance and quality levels unique to the application's individual requirements. The new 3DSP project, which addresses all the different levels, begins with the "simple profile" level. The first MPEG-4 offering, a Simple Profile Audio/Video Decoder, will be available in the fourth quarter of 2001. Optimized for use with the 3DSP's SP-5™ DSP core, the audio/video decoder enables highly effective, rich-feature multimedia and communications applications.

"Compared with previous standards, we believe new functionalities are being addressed with MPEG-4 that meet the need for almost all high-performance streaming AV media required for next generation communication products," said H. D. Boesch, vice president for marketing at 3DSP. "Since MPEG-4 can be used with our powerful configurable SP-5 DSP core, it allows designers to match processor performance with power consumption and die size requirements for the application while accommodating rapidly increasing customer requirements on AV media quality and features."

3DSP recently announced the first milestone in the MPEG-4 project, a joint development partnership with Wipro Limited, a leading software service provider based in Bangalor. The two companies are partnering in the development of MPEG-4 video software that is forward and backward compatible with the H.263 standard, and will continue the partnership to build other wireless and video applications on the 3DSP platform.

About 3DSP

3DSP offers the industry's only fully configurable digital signal processing architecture with a comprehensive object-oriented design environment and application-based intellectual property. 3DSP's technology empowers system designers to create custom SoC solutions in silicon that achieve significant competitive advantages in terms of performance, integration, power consumption, cost and time-to-market for tomorrow's multimedia, wireless and Voice over Packet applications. For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Rd., Irvine, CA 92618, phone: (949) 435-0600 fax: (949) 435-0700.

Contacts:

John Dillon
Young Company
+1 949 376-8404
jdillon@youngcompany.com


Annette Keller
3DSP
+1 949 435 0580
akeller@3dsp.com