09/25/01

AGILENT TECHNOLOGIES LICENSES 3DSP CORPORATION'S CONFIGURABLE DIGITAL SIGNAL PROCESSORS FOR NEXT-GENERATION SOC PRODUCT DEVELOPMENT

PALO ALTO and IRVINE, Calif., Sept. 25, 2001 -- Agilent Technologies Inc. (NYSE: A) and 3DSP Corporation, the leader in configurable digital signal processor (DSP) architectures, today announced that Agilent has licensed 3DSP's family of DSP cores for use in developing next-generation system-on-chip (SOC) products for wireless phones, personal digital assistants and other advanced communications and mobile appliance applications. Under the agreement, Agilent will be allowed to integrate 3DSP's SP-3™, SP-5™ and SP-5flex™ cores and DSP-Shuttle™ Intelligent Bus Controller company-wide into advanced system chips.

"3DSP's configurable DSP processors deliver a significant advantage in tailoring high performance SOC solutions for the mobile appliance and communications markets," said Kathy Tobin, manager for Agilent's Mobile Information Solutions Initiative. "Using this configurability, we can tune the capabilities of the DSP provided by 3DSP to specific application requirements, and deliver very high performance semiconductor solutions that meet the market requirements for optimal power consumption and low cost. We see 3DSP cores as the ideal companion to embedded microprocessors in a wide range of signal processing areas including voice encoding/decoding, data compression and decompression, audio and video processing, and wireless WAN and LAN access."

"We believe that the Agilent licensing agreement represents a significant endorsement of our DSP architecture and our advanced SOC design tools by a major player in the communications marketplace," said Tom Beaver, CEO and president at 3DSP. "We are excited to be working with Agilent and look forward to being a part of their next generation products."

Additional information about Agilent's Mobile SOC products is available at www.agilent.com/view/mobile.

About 3DSP

3DSP is a leader in implementing advanced digital signal processing solutions in silicon for embedded systems. The company offers the industry's only fully configurable DSP architecture, backed by a robust environment and application-based intellectual property to speed complex system-on-chip (SoC) implementations to silicon with first time success. 3DSP's capabilities are used by Internet, broadband, wireless and multimedia designers to implement next generation products. For more information on the company and its products, visit http://www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Road, Irvine, CA 92618; phone: 949-435-0600; fax: 949-435-0700.

About Agilent Technologies

Agilent Technologies Inc. (NYSE: A) is a global technology leader in communications, electronics and life sciences. The company's 43,000 employees serve customers in more than 120 countries. Agilent had net revenue of $9.4 billion in fiscal year 2000, as restated to reflect the sale of its healthcare business. Information about Agilent is available on the Web at www.agilent.com.

Editorial Contacts:

Mark Alden, Agilent
+1 408 654 8741
mark_alden@agilent.com

Annette Keller, 3DSP
+1 949 435 0580
akeller@3dsp.com