09/15/01

3DSP AND SYNTEK SEMICONDUCTOR SIGN DSP IP CORE LICENSING AGREEMENT

IRVINE, CA-(September 15, 1999)-- 3DSP Corporation, a developer of high-performance, low-power digital signal processing (DSP) technology, and SYNTEK Semiconductor, today announced the signing of a licensing agreement between the two companies. As part of this agreement, 3DSP will provide SYNTEK Semiconductor with its DSP IP core technology, which will be incorporated into SYNTEK Semiconductor's line of microcontroller products featuring LCD Drivers. Terms of the agreement are confidential.

"3DSP has emerged as the leader in the DSP market by developing cutting-edge DSPs that are easy to program and implement into our microcontroller solutions," said Eric Lee , vice president of SYNTEK Semiconductor. "We wanted to incorporate a DSP that wouldn't interrupt our development process, and the programming features of 3DSP's technology created the perfect fit for SYNTEK Semiconductor. 3DSP's IP core technology presented the ideal match for our microcontroller products, and the successful integration of their technology into our products was a deciding factor in signing the licensing agreement."

SYNTEK Semiconductor plans to embed 3DSP's DSP cores into its Microcontroller products, such as Image Controller, Communications Controller, High Performance Audio Controller and Voice Recording and Recognition Controller. SYNTEK Semiconductor's existing product lines include Video Controller, LCD Controller, Microcontroller, Voice Controller and Monitor Controller.

"We are excited about this agreement with SYNTEK Semiconductor. Our relationship with SYNTEK Semiconductor brings two complementary technologies together to provide high-performance and innovative solutions," said Kan Lu, president and chief executive officer of 3DSP. "3DSP strives to develop synergistic alliances with companies like SYNTEK Semiconductor in order to provide tangible solutions to the end-user."

3DSP's hard and soft DSP IP cores feature SuperSIMD™ (Super Scalar Instruction Multiple Data) architecture that enables up to 3.2 billion RISC equivalent instructions per second. This programming flexibility allows 3DSP's IP cores to be integrated into a variety of solutions and decreases time-to-market for DSP IP system-on-chip integrators. 3DSP has targeted its hard and soft DSP IP cores for integration into digital appliances, such as voice-over-IP products, 3G wireless phones, cable modems and rotation memory devices.

About SYNTEK Semiconductor

SYNTEK Semiconductor, the first microcontroller design house established in Taiwan was founded in 1983 by a group of first generation Taiwanese semiconductor engineers trained by RCA. The company has more than 16 years experience in the field of supplying microcontroller and DSP related devices with wireless communications, Internet, video control, programmed functions, voice generation, LCD display and monitor controls. They also provide services for ASIC design implementing a total solution for SOC (System on Chip). For more information on SYNTEK Semiconductor visit www.syntekt.com.tw. SYNTEK Semiconductor is located at: 6th Floor, 317 Sung-Chiang Road, Taipei, TAIWAN; phone (02) 25056383; fax (02) 25064323.

About 3DSP

3DSP offers the industry's only fully configurable digital signal processing architecture with a comprehensive object-oriented design environment and application-based intellectual property. 3DSP's technology empowers system designers to create custom system-on-a-chip (SoC) solutions in silicon that achieve significant competitive advantages in terms of performance, integration, power consumption, cost and time-to-market for tomorrow's multimedia, wireless and Voice over Packet applications. For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Rd., Irvine, CA 92618, phone: (949) 435-0600 fax: (949) 435-0700.


Contacts:

Chris Kresch
Young Company
+1 310 899 3375
ckresch@youngcompany.com


Annette Keller
3DSP
+1 949 435 0580
akeller@3dsp.com