07/08/02

3DSP LICENSES ITS SP-5 CORE TO SONY FOR NEXT-GENERATION ADVANCED SEMICONDUCTORS

IRVINE, Calif., June 8, 2002 — 3DSP Corporation, the leader in configurable
digital signal processor (DSP) architectures, today announced that Sony
Corporation has licensed its SP-5™ DSP core and DSP-Shuttle™ Intelligent Bus
Controller for its next-generation semiconductor products. The Sony Corporation
Semiconductor Network Company has agreed to a division-wide, multiple-use
license of the core and controller that will be designed initially into semiconductor
devices for audio applications.

“We are thrilled to enter into a relationship with Sony, who continues to be a great
innovator, and we look forward to facilitating their next-generation products,” said
Kan Lu, CTO at 3DSP. “After going through a rigorous evaluation of our
technology, this agreement represents a major endorsement of the proven usability
of our DSP architectures while further validating our support infrastructure.”

“In this highly competitive marketplace where performance, power and price are
significant factors in gaining a new customer, we are very pleased with the
recognition from Sony,” claimed Didier Boivin, president and CEO of 3DSP.
“This appears to be a very smart relationship,” said Will Strauss, president of
research firm Forward Concepts. “In light of the slow turn-around of the
telecommunications industry, addressing the healthy consumer electronics market with an innovative audio product makes good sense. This new relationship also
confirms the continued viability of the IP business model for DSP cores.”

About 3DSP

3DSP offers the industry’s only fully configurable digital signal processing
architecture with a comprehensive object-oriented design environment and
application-based intellectual property. 3DSP’s technology empowers system
designers to create custom SoC solutions in silicon that achieve significant
competitive advantages in terms of performance, integration, power consumption,
cost and time-to-market for tomorrow’s multimedia, wireless and Voice over Packet
applications. For more information on the company and its products, visit
www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Rd., Irvine,
CA 92618, phone: (949) 435-0600 fax: (949) 435-0700.

For More Information Contact:

Annette Keller
3DSP Corporation
(949) 435-0580
akeller@3dsp.com

SP-5, DSP-Shuttle, 3DSP Corporation and 3DSP are trademarks of 3DSP
Corporation.