HYNIX SEMICONDUCTOR BRINGS SoC FOUNDRY SUPPORT TO 3DSP MASTERPIECE PARTNERSHIP PROGRAM

IRVINE, Calif., May 15, 2001 - 3DSP Corporation™, a leader in configurable, scalable digital signal processor (DSP) architecture, has formed an alliance with Hynix Semiconductor (formerly Hyundai Electronics), an industry leader in high quality semiconductors, to develop advanced System-on-Chip (SoC) foundry capabilities for its DSP-based devices.

As part of the alliance, Hynix will become part of the 3DSP Masterpiece™ partnership program to develop silicon foundry services for DSP-based designs using cores and other IP from 3DSP, empowering SoC designers with access to the latest silicon technologies for use in the communications marketplace. At the same time, 3DSP will join the Hynix SoC Alliance, providing access for Hynix customers to the industry's most advanced set of configurable DSP cores and applications software.

"One of the goals of our Masterpiece partnership program is to make our customers more successful by helping them find the foundry services and capacity they need to get innovative next-generation DSP-based products to market more quickly," said Tom Beaver, CEO and president at 3DSP. "It is important to have a best-in-class foundry partner like Hynix Semiconductor join our program and plan to work with them closely over the coming year to assist in the success for our joint customers. "

"We are pleased to join 3DSP's Masterpiece partnership program to further develop foundry resources for their customers," said Channy Lee, executive director and general manager of Hynix's Semiconductor Manufacturing Business Unit. "We are also delighted to have 3DSP as a Hynix SOC Alliance partner. We hope to help catalyze more business opportunities for joint customers in designing and manufacturing tomorrow's advanced SoC silicon solutions using their industry-leading configurable DSP architecture."

About Hynix Semiconductor
Hynix Semiconductor, Inc., with its principal place of business in Ichon, Korea, is an industry leader in the development, sales, marketing and distribution of high-quality semiconductors including DRAM, SRAM, Flash memory and System IC products. It is the world's largest DRAM supplier with twelve semiconductor manufacturing facilities worldwide. In addition, Hynix is aggressively expanding its System IC business. Hynix plans to derive 25% of it's revenue from System IC products in 2003 by focusing on foundary services and standard products including LCD Display ICs, MCUs and Image Sensor ICs. More information on Hynix Semiconductor Inc. and its products is available from the company's web site at www.hynix.com.

3DSP Corporation, 3DSP, and Masterpiece are trademarks of 3DSP Corporation.