02/25/02 3DSP LAUNCHES MULTI-PROTOCOL WIRELESS LAN DESIGN BASED ON ITS POWERFUL UNIPHY DSP CORE

02/25/02

3DSP LAUNCHES MULTI-PROTOCOL WIRELESS LAN DESIGN BASED ON ITS POWERFUL UNIPHY DSP CORE

IRVINE, Calif., February 25, 2002 - 3DSP Corporation, the leader in configurable digital signal processor (DSP) architectures, now offers an advanced IP-based development platform for multi-protocol Wireless LAN (WLAN) ICs - an industry first. Using this design, licensees will be able to quickly develop advanced SoCs capable of supporting up to three different Wireless LAN modulation/demodulation schemes in parallel. Now, a single IC can be implemented that enables wireless Access Points to support different WLAN network protocols simultaneously, for example accepting both IEEE802.11a and IEEE802.11b data streams at the same time. This multi-channel operability can also be used to accept multiple data streams of the same protocol simultaneously to increase data throughput over a WLAN to any Access Point.

"Our new multi-protocol WLAN reference design is based on our fully synthesizable UniPHY DSP core - the only DSP core available that has been optimized for physical layer processing," said Kan Lu, chief technology officer at 3DSP. "Using the UniPHY architecture, supplemented by five major patent applications in process in the areas of channel estimator, equalizer and Viterbi decoding algorithms, we are able to achieve the unprecedented computational power required for multi-channel WLAN applications. We have also implemented an adaptive power management scheme that we believe will double battery life for ICs designed for portable applications.

"An IC implemented using our WLAN reference design IP will achieve the low cost and power consumption specifications previously only available in the ASIC world, while retaining the programmability that will allow any UniPHY-based SoC to continually track new emerging wireless protocol standards as they are adopted," said Eric Mack, director of marketing at 3DSP. "This soft-PHY approach will promote fast acceptance of wireless LAN standards in a host of next generation consumer platforms including set-top boxes, residential gateways and PDAs. In addition, we are evaluating RF front-end solutions from several industry-leading radio manufacturers, and will be announcing these partnerships later this quarter. We are basing these evaluations on optimized power consumption and overall performance with the 3DSP baseband solution."

"The UniPHY core-based reference design can provide a compelling DSP solution for the wireless LAN market," said Will Strauss, president of market research firm Forward Concepts. "It's the first core I've seen that can achieve performance levels that approach ASIC solutions, while retaining the flexibility for implementing multi-standard solutions that allow licensees to significantly differentiate their products."

The new multi-protocol WLAN development platform from 3DSP will include:

A complete IP development platform with a UniPHY core, Viterbi accelerator, program and data memory, MAC microprocessor and MAC/WEP accelerator, and A/D and D/A converters, all tied together using 3DSP's Shuttle intelligent bus. This IP platform is compatible with advanced WLAN radios;
Complete fully debugged and tested software for implementing the IEEE802.11a baseband standard, capable of handling OFDM (Orthogonal Frequency Division Multiplexing) data transmissions at all prescribed data rates and mod/demod schemes;
Complete fully debugged and tested software for implementing IEEE802.11b baseband standard, capable of handling packetized DSSS (Digitized Sequence Spread Spectrum) data transmissions at all prescribed data rates and mod/demod schemes.
Full IP reference design documentation.

"We are already quite far along in moving the world's first multi-protocol WLAN device to reality, with first silicon expected in August 2002," Lu said. "We have also been working with a leading supplier of WLAN MACs and plan to execute a single chip WLAN PHY/MAC device by Fall 2002. Both of these devices will ultimately be offered by one of our ASIC foundry partners as ASSPs for those wireless LAN supplier who do not choose to pursue a custom solutions that include their own IP."

About 3DSP

3DSP is the leading supplier of advance fully configurable digital signal processing architectures and application-based intellectual property. 3DSP's technology empowers system designers to create custom SoC solutions in silicon that achieve significant competitive advantages in terms of performance, integration, power consumption, cost and time-to-market for tomorrow's multimedia, wireless and Voice over Packet applications. For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Rd., Irvine, CA 92618, phone: (949) 435-0600 fax: (949) 435-0700.